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 HD74HC85
4-bit Magnitude Comparator
REJ03D0555-0200 (Previous ADE-205-427) Rev.2.00 Oct 06, 2005
Description
The HD74HC85 is designed for high speed comparison of two four bit words. This circuit has eight comparison input, 4 for each word; three cascade inputs (A < B, A > B, A = B); and three decision outputs (A < B, A > B, A = B). The result of a comparison is indicated by a high level on one of the decision outputs. Thus it may be determined whether one word is "greater than," "less than," or "equal to" the other word. By connecting the outputs of the least significant stage to the cascade inputs of the next stage, words of greater than four bits can be compared. In addition the least significant stage must have a high level applied to the A = B input, and a low level to the A < B, and A > B inputs.
Features
* * * * * * High Speed Operation: tpd (Data Word Input to Output) = 20 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 A max Low Quiescent Supply Current: ICC (static) = 4 A max (Ta = 25C) Ordering Information
Part Name HD74HC85P HD74HC85FPEL HD74HC85RPEL Package Type DILP-16 pin SOP-16 pin (JEITA) SOP-16 pin (JEDEC) Package Code (Previous Code) PRDP0016AE-B (DP-16FV) PRSP0016DH-B (FP-16DAV) PRSP0016DG-A (FP-16DNV) Package Abbreviation P FP RP -- EL (2,000 pcs/reel) EL (2,500 pcs/reel) Taping Abbreviation (Quantity)
Note: Please consult the sales office for the above package availability.
Rev.2.00, Oct 06, 2005 page 1 of 7
HD74HC85
Function Table
Data Word Inputs A3, B3 A3 > B3 A3 < B3 A3 = B3 A3 = B3 A3 = B3 A3 = B3 A3 = B3 A3 = B3 A3 = B3 A3 = B3 A3 = B3 A3 = B3 A3 = B3 H: L: X: A2, B2 X X A2 > B2 A2 < B2 A2 = B2 A2 = B2 A2 = B2 A2 = B2 A2 = B2 A2 = B2 A2 = B2 A2 = B2 A2 = B2 A1, B1 X X X X A1 > B1 A1 < B1 A1 = B1 A1 = B1 A1 = B1 A1 = B1 A1 = B1 A1 = B1 A1 = B1 A0, B0 X X X X X X A0 > B0 A0 < B0 A0 = B0 A0 = B0 A0 = B0 A0 = B0 A0 = B0 Cascading Inputs A > Bin X X X X X X X X L L H H X A = Bin X X X X X X X X L L L L H A < Bin X X X X X X X X L H L H X A > Bout H L H L H L H L H L H L L Outputs A = Bout L L L L L L L L L L L L H A < Bout L H L H L H L H H H L L L
High level Low level Irrelevant
Pin Arrangement
B3 Data 1 Input AB 4 A>B 5 A=B 6 A16 VCC B3 A3 15 A3 14 B2 13 A2 12 A1 11 B1 10 A0 9 B0
A=B In B2 A>B A>B A2 A1
A=B out B1 ARev.2.00, Oct 06, 2005 page 2 of 7
HD74HC85
Logic Diagram
B3 A3 A>Bout B2 A2
B1 A1 AABin A=Bout
Absolute Maximum Ratings
Item Supply voltage range Input / Output voltage Input / Output diode current Output current VCC, GND current Power dissipation Symbol VCC Vin, Vout IIK, IOK IO ICC or IGND PT Ratings -0.5 to 7.0 -0.5 to VCC +0.5 20 25 50 500 Unit V V mA mA mA mW
Storage temperature Tstg -65 to +150 C Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time.
Recommended Operating Conditions
Item Supply voltage Input / Output voltage Operating temperature Input rise / fall time Note:
*1
Symbol VCC VIN, VOUT Ta tr , tf
Ratings 2 to 6 0 to VCC -40 to 85 0 to 1000 0 to 500
Unit V V C ns
Conditions
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
0 to 400 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics.
Rev.2.00, Oct 06, 2005 page 3 of 7
HD74HC85
Electrical Characteristics
Ta = 25C Item Input voltage Symbol VCC (V) VIH 2.0 4.5 6.0 VIL 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 VOL 2.0 4.5 6.0 4.5 Input current Quiescent supply current Iin ICC 6.0 6.0 6.0 Min 1.5 3.15 4.2 -- -- -- 1.9 4.4 5.9 4.18 5.68 -- -- -- -- -- -- -- Typ -- -- -- -- -- -- 2.0 4.5 6.0 -- -- 0.0 0.0 0.0 -- -- -- -- Max -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.26 0.26 0.1 4.0 Ta = -40 to+85C Min 1.5 3.15 4.2 -- -- -- 1.9 4.4 5.9 4.13 5.63 -- -- -- -- -- -- -- Max -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.33 0.33 1.0 40 V IOH = -4 mA IOH = -5.2 mA Vin = VIH or VIL IOL = 20 A V Unit V Test Conditions
Output voltage
VOH
V
Vin = VIH or VIL IOH = -20 A
IOL = 4 mA IOL = 5.2 mA A Vin = VCC or GND A Vin = VCC or GND, Iout = 0 A
Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25C Item Propagation delay time Symbol VCC (V) tPLH, tPHL 2.0 4.5 6.0 tPLH, tPHL 2.0 4.5 6.0 2.0 4.5 6.0 tPLH, tPHL 2.0 4.5 6.0 2.0 4.5 6.0 Input capacitance Cin -- Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ -- 20 -- -- 20 -- -- 12 -- -- 14 -- -- 5 -- 5 Max 210 42 36 175 35 30 125 25 21 155 31 26 75 15 13 10 Ta = -40 to +85C Min -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max 265 53 45 220 44 37 155 31 26 195 39 33 95 19 16 10 pF ns A1 or B1 to C4 ns A1 or B1 to 1 Unit ns Test Conditions C0 to 1
tPLH, tPHL
ns
C0 to C4
Output fall time
tTHL
ns
Rev.2.00, Oct 06, 2005 page 4 of 7
HD74HC85
Test Circuit
VCC VCC Output
See Function Table
Input Pulse generator Zout = 50
A3 B3 A2 B2 A1 B1 A0 B0 AB
A>B CL = 50 pF Output A=B CL = 50 pF Output ANote: CL includes the probe and jig capacitance.
Waveforms
tr 90 % 50 % 10 % t PLH 90 % Same-phase output 50 % 10 % t TLH 90 % 50 % 10 % t PHL 90 % 50 % 10 % t THL VOH VOL tf VCC 0V
Input
t PHL 90 % Inverse-phase output
t PLH
90 % 50 % 10 % t THL 50 % 10 % t TLH
VOH VOL
Notes: 1. Input waveform: PRR 1 MHz, Zo = 50 , tr 6 ns, tf 6 ns 2. The output are measured one at a time with one transition per measurement.
Rev.2.00, Oct 06, 2005 page 5 of 7
HD74HC85
Package Dimensions
JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g
D
16
9
1 0.89 b3
8
Z
E
A1
A
Reference Symbol
Dimension in Millimeters Min Nom 7.62 19.2 6.3 20.32 7.4 5.06 0.51 0.40 0.48 1.30 0.19 0 2.29 2.54 0.25 0.31 15 2.79 1.12 2.54 0.56 Max
e D E
1
L
A A1
e
bp
e1
b c b c
p 3
e Z ( Ni/Pd/Au plating ) L
JEITA Package Code P-SOP16-3.95x9.9-1.27
RENESAS Code PRSP0016DG-A
Previous Code FP-16DNV
MASS[Typ.] 0.15g
*1
D 9
F
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
Index mark
*2
E
HE
c
Reference Symbol
Dimension in Millimeters Min Nom 9.90 3.95 Max 10.30
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
D E A2
8 bp x M L1
A1 A bp b1 c c
1
0.10
0.14
0.25 1.75
0.34
0.40
0.46
0.15
0.20
0.25
HE
0 5.80 6.10 1.27
8 6.20
A
A1
L y
e x y
0.25 0.15 0.635 0.40
1
Detail F
Z L L 0.60 1.08
1.27
Rev.2.00, Oct 06, 2005 page 6 of 7
HD74HC85
JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B Previous Code FP-16DAV MASS[Typ.] 0.24g
*1
D F 9
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
Index mark
Reference Symbol
*2
c
Dimension in Millimeters Min Nom 10.06 5.50 Max 10.5
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
D E A2
8 bp x M L1
A1 A bp b1 c
0.00
0.10
0.20 2.20
0.34
0.40
0.46
0.15
1
0.20
0.25
A
c
HE
0 7.50 7.80 1.27
8 8.00
A1
y L
e x y
0.12 0.15 0.80 0.50
1
Detail F
Z L L 0.70 1.15
0.90
Rev.2.00, Oct 06, 2005 page 7 of 7
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
http://www.renesas.com
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(c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0


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